Packaging Process Engineer Jobs in Malaysia

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Search parameters used for this particular query: Packaging Process Engineer job / career / vacancy; job location: Malaysia.
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Process Equipment Engineer

Date: 2023-12-03 (Cached)

Job Description: As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process…

Company: INTEL
Hiring Organization: INTEL
Salary: TBD
Location: Kulim
Street Address: TBD

Locality: Kulim
Region: disclosed when applied
Postal code: disclosed when applied


Job Details




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Senior R&D Packaging Engineer

Date: 2023-12-03 (Cached)

Job Description: Open mind to new technologies, knowledge sharing, experiences and processes. Ensure product optimization of new and existing manufacturing processes, and design…

Company: Ambu
Hiring Organization: Ambu
Salary: TBD
Location: Penang
Street Address: TBD

Locality: Penang
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



Process Development Engineer

Date: 2023-12-03 (Cached)

Job Description: At least > 6 years of experience in the process development or semiconductor packaging R&D. Possess direct technical background and hands on experience in Die…

Company: Wolfspeed
Hiring Organization: Wolfspeed
Salary: TBD
Location: Ipoh
Street Address: TBD

Locality: Ipoh
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



Staff Packaging Engineer

Date: 2023-12-03 (Cached)

Job Description: Power Integrations is looking for experience talent with highly motivation as the staff packaging engineer, to manage and to drive improvement on assembly and…

Company: Power Integrations
Hiring Organization: Power Integrations
Salary: TBD
Location: Penang
Street Address: TBD

Locality: Penang
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



PGDM - Penang Advanced Packaging Chemical Lab Engineer

Date: 2023-12-03 (Cached)

Job Description: As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process…

Company: INTEL
Hiring Organization: INTEL
Salary: TBD
Location: Penang
Street Address: TBD

Locality: Penang
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



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Graduate Technical Program (GTP) : Engineer Process

Date: 2023-12-03 (Cached)

Job Description: Ensure the robustness of processes by Implementing process control system including SPC, APC ( advance process control) and run-to-run.

Company: Infineon Technologies
Hiring Organization: Infineon Technologies
Salary: TBD
Location: Kulim
Street Address: TBD

Locality: Kulim
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



GRADUATE TECHNICAL PROGRAME - ENGINEER PROCESS

Date: 2023-12-03 (Cached)

Job Description: Perform process engineering and production support in one selected assigned area of semiconductor process. Please let your recruiter know if they need to pay…

Company: Infineon Technologies
Hiring Organization: Infineon Technologies
Salary: TBD
Location: Kulim
Street Address: TBD

Locality: Kulim
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



DfX & DtX Engineer (Packaging & Sterilization)

Date: 2023-12-03 (Cached)

Job Description: Hands-on experience in troubleshooting the packaging process. Experiences in product packaging design/ sterilization.

Company: B. Braun Medical Ind. Sdn. Bhd.
Hiring Organization: B. Braun Medical Ind. Sdn. Bhd.
Salary: TBD
Location: Bayan Lepas
Street Address: TBD

Locality: Bayan Lepas
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



PGDM Process Engineer Metrology

Date: 2023-12-03 (Cached)

Job Description: Train production/receiving process engineers of high-volume factories. Conducting process, equipment and material development projects with equipment and…

Company: INTEL
Hiring Organization: INTEL
Salary: TBD
Location: Penang
Street Address: TBD

Locality: Penang
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



Manufacturing Process Engineer

Date: 2023-12-03 (Cached)

Job Description: Degree in packaging engineering, mechanical and/or electrical engineering, process, manufacturing engineering or equivalent. Expiry Date: 18 December 2023.

Company: Monroe Consulting Group
Hiring Organization: Monroe Consulting Group
Salary: TBD
Location: Malaysia
Street Address: TBD

Locality: Malaysia
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



Package Reliability Engineer

Date: 2023-12-03 (Cached)

Job Description: Detailed knowledge of semiconductor component package assembly processes and challenges. To request assistance with the application process and/or for…

Company: Micron
Hiring Organization: Micron
Salary: TBD
Location: Batu Kawan
Street Address: TBD

Locality: Batu Kawan
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



Lead Packaging Development Engineer

Date: 2023-12-03 (Cached)

Job Description: Ensure engineers develop innovative packaging solutions that align with the packaging vision and meet the intended purpose of each product.

Company: Dyson
Hiring Organization: Dyson
Salary: TBD
Location: Johor Bahru
Street Address: TBD

Locality: Johor Bahru
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



Manufacturing Engineer

Date: 2023-12-03 (Cached)

Job Description: Now, as a company with an extensive customer base globally, we are looking for a passionate manufacturing engineer to scale new products to volume production…

Company: Vitrox
Hiring Organization: Vitrox
Salary: TBD
Location: Batu Kawan
Street Address: TBD

Locality: Batu Kawan
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



PGDM Wet Etch Module Engineer

Date: 2023-12-03 (Cached)

Job Description: Owns process development line items aligned to high volume process nodes. Owns detection of discrepant material or activities of the equipment and process.

Company: INTEL
Hiring Organization: INTEL
Salary: TBD
Location: Penang
Street Address: TBD

Locality: Penang
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



Design Engineer

Date: 2023-12-03 (Cached)

Job Description: Develop products according to HID’s product development process. Knowledge of electronic assembly and packaging methods would be an advantage.

Company: ASSA ABLOY
Hiring Organization: ASSA ABLOY
Salary: TBD
Location: Malaysia
Street Address: TBD

Locality: Malaysia
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



Product Engineer

Date: 2023-12-03 (Cached)

Job Description: ViTrox is a design and manufacturing company that powers machine vision solutions for semiconductor and electronics packaging companies. V care and value your….

Company: Vitrox
Hiring Organization: Vitrox
Salary: TBD
Location: Batu Kawan
Street Address: TBD

Locality: Batu Kawan
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



Project Engineer / Sr. Project Engineer (PMO)

Date: 2023-12-03 (Cached)

Job Description: ViTrox is a design and manufacturing company that powers machine vision solutions for semiconductor and electronics packaging companies. V care and value your….

Company: Vitrox
Hiring Organization: Vitrox
Salary: TBD
Location: Batu Kawan
Street Address: TBD

Locality: Batu Kawan
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



Manufacturing System Intern

Date: 2023-12-03 (Cached)

Job Description: � Learn to conduct training/education and vast communication when implementing any business process or system. Knowledge of SQL will be an added advantage.

Company: INTEL
Hiring Organization: INTEL
Salary: TBD
Location: Kulim
Street Address: TBD

Locality: Kulim
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



Assistant Engineer

Date: 2023-12-03 (Cached)

Job Description: Management of product and process validations program. Support yield improvement activities coverage on all shifts in Dip Room and First Inspection and…

Company: BD
Hiring Organization: BD
Salary: TBD
Location: Kulim
Street Address: TBD

Locality: Kulim
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



Quality Engineer

Date: 2023-12-03 (Cached)

Job Description: ・ To support local raw material and packaging introduction. ・ To perform and coordinate on SHE/Q management system internal audit, process, product and…

Company: Pasona Malaysia
Hiring Organization: Pasona Malaysia
Salary: TBD
Location: Perak
Street Address: TBD

Locality: Perak
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



Design Engineer

Date: 2023-12-03 (Cached)

Job Description: At our Global Development Centre in Johor Bahru, Malaysia, there are a mixture of design engineers, technical engineers, test engineers, electronic/electrical…

Company: Dyson
Hiring Organization: Dyson
Salary: TBD
Location: Johor Bahru
Street Address: TBD

Locality: Johor Bahru
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



Die Bond Process Engineer

Date: 2023-12-03 (Cached)

Job Description: Coaching to junior engineer and technician on process and equipment. Experience in semiconductor package design, advance packaging experience, and Assembly…

Company: Ambition
Hiring Organization: Ambition
Salary: TBD
Location: Malaysia
Street Address: TBD

Locality: Malaysia
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



Technical Training Intern

Date: 2023-12-03 (Cached)

Job Description: Continuous Learning orientation to implement scalable solutions based on process connections and end to end mindset. This role will require an on-site presence.

Company: INTEL
Hiring Organization: INTEL
Salary: TBD
Location: Penang
Street Address: TBD

Locality: Penang
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



EHS Engineer

Date: 2023-12-03 (Cached)

Job Description: As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process…

Company: INTEL
Hiring Organization: INTEL
Salary: TBD
Location: Penang
Street Address: TBD

Locality: Penang
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



TEG Assembly Integrator and Quality Engineer

Date: 2023-12-03 (Cached)

Job Description: Current or prior module engineer experience is advantage. Responsibility for Operation Excellence also including making overall processes at TEG Assembly area…

Company: INTEL
Hiring Organization: INTEL
Salary: TBD
Location: Penang
Street Address: TBD

Locality: Penang
Region: disclosed when applied
Postal code: disclosed when applied


Job Details



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